大家好,我是小马老师。
本文复现一篇论文的模型建模过程。
模型参考论文“Effects of intermetallic compound layer thickness on the mechanical properties of silicon-copper interface”,主要研究了化合物厚度对Cu/Si界面性能的影响。
论文下载地址:
https://doi.org/10.1016/j.matdes.2021.110251
建模代码:
units metal
boundary p p p
atom_style atomic
timestep 0.001
neighbor 2 bin
neigh_modify every 1 delay 0 check yes
region box block 0 100 0 20 0 60 units box
create_box 2 box
lattice fcc 3.61
region cu block INF INF INF INF INF 25 units box
create_atoms 1 region cu
lattice diamond 5.43
region si block INF INF INF INF 25 INF units box
create_atoms 2 region si
region middle block INF INF INF INF 25 35 units box
create_atoms 1 random 1500 9899 middle
create_atoms 2 random 1500 68678 middle
region crack block 35 65 INF INF 28 32 units box
delete_atoms region crack
mass 1 64
mass 2 28
pair_style hybrid eam/fs tersoff lj/cut 10
pair_coeff * * eam/fs Cu1.eam.fs Cu NULL
pair_coeff * * tersoff SiC.tersoff NULL Si
pair_coeff 1 2 lj/cut 0.0846 2.99
write_data all.data
write_dump all xyz all.xyz modify element Cu Si
建模结果如图所示:
建模完成之后添加拉伸代码即可,具体可参考公众号拉伸案例。
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